Cutting and engraving of two dimensional (flat) material such as: paper, cardboard, wood, cork, plastic, foil, synthetic fiber, natural fiber, leather
forbidden materials: metals, polyvinyl chloride (PVC), Vinyle, Neoprene, Teflon (PTFE), as well as high glue amount (MDF, HDF)and light-weight foamboards (Kapa) und hard-foam boards (Styrodur etc.)
Lasertemplate
Epilog Laser_Driver Installs
Epilog Laser_Manual
Laser_Anforderungen
Epilog Laser_Job Manager Instructions
Epilog ZING 40
40 WATTS LASERCUTTER / -ENGRAVER
Cutting and engraving of two dimensional (flat) material such as: paper, cardboard, wood, cork, plastic, foil, synthetic fiber, natural fiber, leather
forbidden materials: metals, polyvinyl chloride (PVC), Vinyle, Neoprene, Teflon (PTFE), as well as high glue amount (MDF, HDF)and light-weight foamboards (Kapa) und hard-foam boards (Styrodur etc.)